上海金泰诺材料科技有限公司

上海原装进口松下芯片倒装底填胶CV5300AK01EPS

CV5300AK

TECHNICAL INFORMATION

Encapsulation Materials Department Plastic Materials Business Unit Electronic Materials Business Division

Panasonic Industory Co., Ltd

This is one component epoxy for Flip-chip underfilling.

TYPICAL PROPERTIES

Properties

Unit

Data

Test Method

Viscosity(25oC)

Pa*s

20

KES-B-0102

Gelation time

sec

800

EKS-B-1051

RECOMMENDING PREHEAT CONDITION

temperature of substrate : 80～120oC

temperature of syringe : R.T.～ 60oC

TYPICAL CURED PROPERTIES

Measurement Cure Conditions : 100'C2hour + 150`C 2hour

・Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

・Please use up the material within 12 hrs.

・Compound must be stored in the cool condition with sealing.

・Please keep material under -40oC after receiving product.

ATTENTION TO HANDLING

・Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

・Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

上海原装进口松下芯片倒装底填胶CV5300AK01EPS

上海金泰诺材料科技有限公司是由在胶粘剂行业拥有10余年从业经验的专YE人士创立，是一家专为电子、工业等制造领域客户提供胶粘剂解决方案的供应商。我们与国内外知MING品牌胶粘剂厂家合作，组建了一支专YE的销售及技术团队,只为在进口品牌替代、国外特殊产品引进以及产品的选择、应用及售后技术支持等方面，为您提供更精ZHUN、更专YE、更高XIAO的服务。

公司主要致力于为LED照明、家用电器、消费电子、集成电路封装、光通信、新能源电池、汽车零部件、电源模块、风电、AR眼镜、智能水表、电机等行业用胶方案的提供。在胶粘剂方面，公司注重新材料的开发和应用，不断提升用胶产品的品质和性能，提高国内生产型企业产品在国内国际市场的竞争力。积极配合和制定相关产品的粘结方案，解决行业内产品用胶难点的突破。